Ultra-Reliable Microelectronics Packaging

Through our strategic partner network, UK Electronics offers advanced wire bonding and microelectronics packaging services, delivering high-performance interconnect solutions for aerospace, medical, automotive, and semiconductor industries.

Our Wire Bonding service offering:

• Wire Bonding: Gold & aluminium (ball, wedge, ribbon), fine-pitch, high-density
• Microelectronics Packaging: COB, hybrid circuits, multi-chip modules
• Custom encapsulation, die attach, and thermal management
• Cleanroom-compatible processes
• From prototype to full production, with rapid turnaround and engineering support.